Microsystem optoelectronic integration for mixed multisignal systems

The integration and packaging of optoelectronic devices with electronic cir cuits and systems has growing application in many fields, ranging from long to micro haul links. An exploration of the opportunities, integration tech nologies, and some recent results using thin-film device heterogeneous inte gration with Si CMOS VLSI and GaAs MESFET circuit technologies are presente d in this paper. Applications explored herein include alignment tolerant op toelectronic links for network interconnections, smart pixel focal plane ar ray processing through the integration of imaging arrays with sigma delta a nalog to digital converters underneath each pixel, and three dimensional co mputational systems using vertical through-Si optical interconnections.