Research work focusing on the enhancement of large-signal current-voltage (
I-V) capabilities has resulted in significant performance improvement for A
lGaN/GaN HEMT's. 100-150 mum wide devices grown on SIC substrates demonstra
ted a record power density of 9.8 W/mm at 8 GHz, which is about ten times h
igher than GaAs-based FETs; similar devices grown on sapphire substrates sh
owed 6.5 W/mm, which was thermally limited, 2-mm-wide devices flip-chip mou
nted on to AlN substrates produced 9.2-9.8 W output power at 8 GHz with 44-
47% PAE, A flip-chip amplifier IC using a 4-mm device generated 14 W at 8 G
Hz, representing the highest CW power obtained from GaN-based integrated ci
rcuits to date.