Very-high power density AlGaN/GaN HEMTs

Citation
Yf. Wu et al., Very-high power density AlGaN/GaN HEMTs, IEEE DEVICE, 48(3), 2001, pp. 586-590
Citations number
5
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON ELECTRON DEVICES
ISSN journal
00189383 → ACNP
Volume
48
Issue
3
Year of publication
2001
Pages
586 - 590
Database
ISI
SICI code
0018-9383(200103)48:3<586:VPDAH>2.0.ZU;2-5
Abstract
Research work focusing on the enhancement of large-signal current-voltage ( I-V) capabilities has resulted in significant performance improvement for A lGaN/GaN HEMT's. 100-150 mum wide devices grown on SIC substrates demonstra ted a record power density of 9.8 W/mm at 8 GHz, which is about ten times h igher than GaAs-based FETs; similar devices grown on sapphire substrates sh owed 6.5 W/mm, which was thermally limited, 2-mm-wide devices flip-chip mou nted on to AlN substrates produced 9.2-9.8 W output power at 8 GHz with 44- 47% PAE, A flip-chip amplifier IC using a 4-mm device generated 14 W at 8 G Hz, representing the highest CW power obtained from GaN-based integrated ci rcuits to date.