Low temperature metal-organic chemical vapor deposition of (Ba,Sr)TiO3 thin films for capacitor applications

Citation
Cs. Hwang et al., Low temperature metal-organic chemical vapor deposition of (Ba,Sr)TiO3 thin films for capacitor applications, INTEGR FERR, 30(1-4), 2000, pp. 37-44
Citations number
6
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Eletrical & Eletronics Engineeing
Journal title
INTEGRATED FERROELECTRICS
ISSN journal
10584587 → ACNP
Volume
30
Issue
1-4
Year of publication
2000
Pages
37 - 44
Database
ISI
SICI code
1058-4587(2000)30:1-4<37:LTMCVD>2.0.ZU;2-A
Abstract
Low temperature metal-organic chemical vapor deposition (MOCVD) processes f or producing high dielectric (Ba,Sr)TiO3 (BST) films studied using a noble dome type reactor, liquid delivery technique and new precursors. One of the problems associated with conventional MOCVD reactors having a shower head was substrate surface-dependent deposition of film composition as well as t he thickness. which might result in pattern-dependent deposition of BST fil ms. The new chamber used in this study was capable of controlling both the substrate heater and chamber wall temperatures which successfully eliminate d such surface-dependent deposition property. The film composition and thic kness were essentially the same on either Pt and SiO2 surfaces when both th e wall and heater temperatures were controlled. However, the film compositi on, thickness and uniformity were differed markedly on the Pt and SiO2 surf aces when only the heater temperature was controlled. Excellent step covera ge and smooth (haze-free) surface morpholgy of BST films were obtained from a deposition at 470 degreesC.