Effect of processing conditions on inversion layer mobility and interface state density in 4H-SiC MOSFETs

Citation
S. Banerjee et al., Effect of processing conditions on inversion layer mobility and interface state density in 4H-SiC MOSFETs, J ELEC MAT, 30(3), 2001, pp. 253-259
Citations number
23
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
30
Issue
3
Year of publication
2001
Pages
253 - 259
Database
ISI
SICI code
0361-5235(200103)30:3<253:EOPCOI>2.0.ZU;2-4
Abstract
N-channel, inversion mode MOSFETs have been fabricated on 4H-SiC using diff erent oxidation procedures, source/drain implant species and implant activa tion temperature. The fixed oxide charge and the field-effect mobility in t he inversion layer have been extracted, with best values of 1.8 x 10(12) cm (-2) and 14 cm(2) N-s, respectively. The interface state density, D-it clos e to the conduction band of 4H-SiC has been extracted from the subthreshold drain characteristics of the MOSFETs. A comparison of interface state dens ity, inversion layer mobility and fixed oxide charges between the different processes indicate that pull-out in wet ambient after reoxidation of gate oxide improves the 4H-SiC/SiO2 interface quality.