A microindentation technique for determining strength of solder interface with silver metallization on co-fired multilayer ceramic substrate

The use of microindentation to determine the strength of a solder interface was explored in low-temperature co-fired multilayer ceramic packages. Micr oindentations were made on cross-sections of multilayered structures at sma ll stand-off distances from the interface under different indentation loads . Cracking behavior of the interface was observed following indentations. A t low indentation loads and large stand-off distances, well-known indentati on crack systems developed in the ceramic. Higher indentation loads and sma ller standoff distances resulted in interfacial cracking. It is demonstrate d that the indentation condition at the onset of the interfacial cracking m ay be used as a measure of the interfacial strength.