Solder bridge mechanism in surface mount technology

Authors
Li, MY Wang, CQ Zhang, L
Citation
My. Li et al., Solder bridge mechanism in surface mount technology, PROG NAT SC, 11(3), 2001, pp. 221-225
Citations number
2
Categorie Soggetti
Multidisciplinary
Journal title
PROGRESS IN NATURAL SCIENCE
ISSN journal
10020071 → ACNP
Volume
11
Issue
3
Year of publication
2001
Pages
221 - 225
Database
ISI
SICI code
1002-0071(200103)11:3<221:SBMISM>2.0.ZU;2-Y
Abstract
In the light of the minimum energy principle, the energy equation for the f orming process of a joint is formulated, and the forming process of bridged joints is numerically simulated. On this basis, the mechanism of bridging in surface mount technology (SMT) is investigated.