Chemical vapor deposition (CVD) processes have a large throwing power and c
an operate at atmospheric pressure. Therefore, they are economical for many
applications. High-temperature CVD processes give a good control of the cr
ystal structure (e.g., epitaxial layers or other special layer structures)
and support diffusion processes. The are used, for example, for the followi
ng deposition processes: 1) perovskites, 2) yttrium-stabilized ZrO2 layers
as ion conductors or heat barrier coatings, 3) aluminide diffusion coatings
in long tubes for corrosion protection, and 4) BN on fibers for fiber-rein
forced materials. The special properties of the perovskite CVD are discusse
d in more detail. These processes are described for small- and large-scale
applications. The CVD process is simulated by the computer code Fluent.