Fracture of a ductile layer constrained by stiff substrates

Citation
Sh. Choi et al., Fracture of a ductile layer constrained by stiff substrates, FATIG FRACT, 24(1), 2001, pp. 1-13
Citations number
33
Categorie Soggetti
Material Science & Engineering
Journal title
FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES
ISSN journal
8756758X → ACNP
Volume
24
Issue
1
Year of publication
2001
Pages
1 - 13
Database
ISI
SICI code
8756-758X(200101)24:1<1:FOADLC>2.0.ZU;2-D
Abstract
A combined experimental and theoretical analysis of the fracture behaviour of brass/solder/brass sandwich specimens is conducted. First, the theories of interfacial fracture initiation for a ductile layer sandwiched between e lastic substrates are reviewed. The fracture behaviours are then reported o f brass/solder/brass sandwich specimens under various mode mixities. Additi onally, the effects of solder layer thickness b and specimen lateral thickn ess t are presented. The effects of mode mix and plastic constraint on the failure mechanism and toughness are analysed.