Physical design guides for substrate noise reduction in CMOS digital circuits

Citation
M. Nagata et al., Physical design guides for substrate noise reduction in CMOS digital circuits, IEEE J SOLI, 36(3), 2001, pp. 539-549
Citations number
27
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE JOURNAL OF SOLID-STATE CIRCUITS
ISSN journal
00189200 → ACNP
Volume
36
Issue
3
Year of publication
2001
Pages
539 - 549
Database
ISI
SICI code
0018-9200(200103)36:3<539:PDGFSN>2.0.ZU;2-U
Abstract
Substrate noise injection in large-scale CMOS logic integrated circuits is quantitatively evaluated by 100-muV 100-ps resolution substrate noise measu rements of controlled substrate noises by a transition-controllable noise s ource and practical substrate noises under CMOS logic operations. The noise injection is dominated by leaks of supply/return bounce into the substrate , and the noise intensity is determined by logic transition activity, accor ding to experimental observations. A time-series divided parasitic capacita nce model is derived as an efficient estimator of the supply current for si mulating the substrate noise injection and can reproduce the measured subst rate noise waveforms. The efficacy of physical noise reduction techniques a t the layout and circuit levels is quantified and limitations are discussed in conjunction with the noise injection mechanisms. The reduced supply bou nce CMOS circuit is proposed as a universal noise reduction technique, and more than 90% noise reduction to conventional CMOS is demonstrated.