High quality and stable silicon dioxide (SiO2) films are grown on gallium a
rsenide (GaAs) substrate by liquid phase deposition (LPD) method at room te
mperature, with specific emphasis on passivation layer application. The LPD
SiO2 film is of uniformity less than the similar to1.2%. A maximum growth
rate and refractive index of silicon dioxide of 1300 Angstrom /h and 1.423
are obtained, respectively. The leakage current of as-deposited SiO2 is 42
pA and the dielectric breakdown field is II MV/cm. The film quality demonst
rates its potential in fabricating high-speed devices. (C) 2001 Elsevier Sc
ience B.V. All rights reserved.