Crystalline yttria-stabilized zirconia oxide (YSZ) film was successfully de
posited on a silicon wafer without an interfacial amorphous SiO2 layer. The
film with equivalent oxide thickness t(eox) down to 1.77 nm shows negligib
le hysteresis and low interface state density, less than 3 x 10(11) cm(-2)
eV(-1). The leakage current density for t(eox) = 1.77 nm film, 1.5 x 10(-5)
A cm(-2) at 1 V bias voltage, is five orders of magnitude lower than that
for SiO2 with the same equivalent oxide thickness. The results demonstrate
that an ultra-thin YSZ film has sufficient resistivity against the Formatio
n of an underlying amorphous layer, and can be a promising gate dielectric
replacing SiO2 to reduce the feature size of devices.