C4 makes way for electroplated bumps

Authors
Clegg, D Cole, R Franka, J Mitchell, D Wontor, D
Citation
D. Clegg et al., C4 makes way for electroplated bumps, SOL ST TECH, 2001, pp. S4
Citations number
4
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLID STATE TECHNOLOGY
ISSN journal
0038111X → ACNP
Year of publication
2001
Supplement
S
Database
ISI
SICI code
0038-111X(200103):<S4:CMWFEB>2.0.ZU;2-P