Structure and properties of silicon oxide films deposited in a dual microwave-rf plasma reactor

Citation
N. Benissad et al., Structure and properties of silicon oxide films deposited in a dual microwave-rf plasma reactor, THIN SOL FI, 384(2), 2001, pp. 230-235
Citations number
34
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
384
Issue
2
Year of publication
2001
Pages
230 - 235
Database
ISI
SICI code
0040-6090(20010315)384:2<230:SAPOSO>2.0.ZU;2-J
Abstract
The characterisation of SiOx thin films deposited from hexamethyldisiloxane in a microwave plasma reactor showed they were carbon containing and porou s. With the aim of improving the film quality, the substrate holder was bia sed with the use of a 13.56-MHz radio-frequency power supply. Results on ch emical structure, deposition rate and optical emission spectroscopy are rep orted. The rf-induced negative bias voltage affected both gas phase reactio ns and film composition. Moreover, it induced change in the deposition rate . (C) 2001 Elsevier Science B.V. All rights reserved.