Laser processing of amorphous silicon for large-area polysilicon imagers

Citation
Jb. Boyce et al., Laser processing of amorphous silicon for large-area polysilicon imagers, THIN SOL FI, 383(1-2), 2001, pp. 137-142
Citations number
11
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
383
Issue
1-2
Year of publication
2001
Pages
137 - 142
Database
ISI
SICI code
0040-6090(20010215)383:1-2<137:LPOASF>2.0.ZU;2-C
Abstract
Pulsed excimer-laser processing of amorphous silicon on non-crystalline sub strates allows for the fabrication of high-quality polysilicon materials an d thin-film transistors (TFTs). Under optimized processing conditions, thes e polysilicon TFTs have high mobilities, sharp turn-on, low off-state leaka ge currents and good spatial uniformity. These improved parameters, particu larly the low off-state leakage currents and good uniformity, enable, not o nly displays, but also the more demanding hat-panel imaging arrays to be fa bricated in polysilicon, and results on an imager are presented. (C) 2001 E lsevier Science B.V. All rights reserved.