Interfacial reactions between thin rare-earth-metal oxide films and Si substrates

Citation
H. Ono et T. Katsumata, Interfacial reactions between thin rare-earth-metal oxide films and Si substrates, APPL PHYS L, 78(13), 2001, pp. 1832-1834
Citations number
17
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
78
Issue
13
Year of publication
2001
Pages
1832 - 1834
Database
ISI
SICI code
0003-6951(20010326)78:13<1832:IRBTRO>2.0.ZU;2-R
Abstract
Rare-earth-metal oxide films (Ln(2)O(3); Ln=Y, La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Er, Tm, and Yb) between 20 and 30 nm thick were grown on Si substrates by using a pyrolysis method. We found that a silicate (LnSiO) layer and a s ilicon oxide layer were formed at the interface between oxides and substrat e after postannealing. The infrared absorption of the Si-O-Ln bonds increas ed as the postannealing temperature rose. The Si-O-Ln bond formation strong ly depended on the ion radii of the rare-earth elements. We conclude that a n interfacial silicate layer can easily be formed by a reaction with Si ato ms diffusing from the substrate for oxides with larger ion radii. This is b ecause such oxides may have a larger space between atoms. The quantity of S i-O-Si bonds also increased after postannealing. The increase in the Si-O-S i bonds for Ln(2)O(3) was independent of the elements, and almost the same as the increases for Ta2O5 and ZrO2. (C) 2001 American Institute of Physics .