Mass transport characteristics in a pulsed plasma enhanced chemical vapor deposition reactor for thin polymer film deposition

Citation
Ko. Goyal et al., Mass transport characteristics in a pulsed plasma enhanced chemical vapor deposition reactor for thin polymer film deposition, IEEE PLAS S, 29(1), 2001, pp. 42-50
Citations number
23
Categorie Soggetti
Physics
Journal title
IEEE TRANSACTIONS ON PLASMA SCIENCE
ISSN journal
00933813 → ACNP
Volume
29
Issue
1
Year of publication
2001
Pages
42 - 50
Database
ISI
SICI code
0093-3813(200102)29:1<42:MTCIAP>2.0.ZU;2-E
Abstract
A pulsed plasma enhanced chemical vapor deposition (PECVD) reactor is used for the preparation of thin polyacetylene films. A theoretical model based on the mass transport characteristics of the reactor is developed in order to correlate with experimentally obtained spatial deposition profiles for t he acetylene plasma polymer film deposited within the cylindrical reactor. Utilizing a free radical mechanism with gas phase initiation of the polymer ization reaction as the rate controlling step, a system parametric study is performed to predict the Peclet number range of operation for the pulsed P ECVD reactor. This parametric study indicates radical decay by diffusion to the reactor walls to be the significant physical phenomenon in the system. It is concluded that a quasi-steady-state model is a good tool for predict ing the important mass transfer phenomena occurring in the pulsed plasma re actor.