Statistical analysis of shallow p-n junction leakage increase using XTEM results probabilities

Citation
A. Czerwinski et al., Statistical analysis of shallow p-n junction leakage increase using XTEM results probabilities, MAT SC S PR, 4(1-3), 2001, pp. 105-107
Citations number
9
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
ISSN journal
13698001 → ACNP
Volume
4
Issue
1-3
Year of publication
2001
Pages
105 - 107
Database
ISI
SICI code
1369-8001(200102/06)4:1-3<105:SAOSPJ>2.0.ZU;2-K
Abstract
The reverse current increase for CoSi2 silicided Si n(+)p shallow junctions is investigated, with particular interest for the diffusion component (I-d ), being the fundamental lower limit. The non-uniformity of the CoSi2 layer is shown to enhance I-d even without the presence of a catastrophic spikin g defect. The n(+) emitter thinning due to the Co reaction with Si enhances I-d by a reduction of the Gummel number. Here it is shown that, in additio n, local silicide thickness Variations cause a more than linear increase of I-d. A more general method for analysis of the physical variables (the ave rage junction depth x(j) and I-d) is shown, based on thickness statistical fluctuations, which are derived from cross-sectional transmission electron microscopy (XTEM) observations. It is applied for junctions with 50-200 nm mean depths. (C) 2001 Elsevier Science Ltd. All rights reserved.