Chromium layers 800 Angstrom thick are deposited by electron gun evaporatio
n on: respectively, non-implanted, 5 x 10(14) and 5 x 10(15) at./cm(2) P+-i
mplanted Si(111) substrates. The redistribution of phosphorus and the influ
ence on chromium silicide growth are analyzed by secondary ion mass spectro
scopy (SIMS) and Rutherford backscattering spectroscopy (RBS) after anneali
ng between 450 degrees and 550 degreesC. It is shown that chromium silicide
formation is retarded or inhibited by the presence of phosphorus. The impl
ant diffuses out of the CrSi2 surface layer in both implantation cases, but
also accumulates at the CrSi2/Si interface in the case of the higher dose.
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