How to minimize component thermal overstress failures (part 2)

Authors
Lakshminarayanan, V
Citation
V. Lakshminarayanan, How to minimize component thermal overstress failures (part 2), ELECTR DES, 49(6), 2001, pp. 115
Citations number
7
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
ELECTRONIC DESIGN
ISSN journal
00134872 → ACNP
Volume
49
Issue
6
Year of publication
2001
Database
ISI
SICI code
0013-4872(20010319)49:6<115:HTMCTO>2.0.ZU;2-4
Abstract
Some practical tips harness the all-too-often ignored techniques of thermal design to improve product reliability.