Effect of UV/ozone treatment on surface tension and adhesion in electronicpackaging

Authors
Citation
Sj. Luo et Cp. Wong, Effect of UV/ozone treatment on surface tension and adhesion in electronicpackaging, IEEE T COMP, 24(1), 2001, pp. 43-49
Citations number
14
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN journal
15213331 → ACNP
Volume
24
Issue
1
Year of publication
2001
Pages
43 - 49
Database
ISI
SICI code
1521-3331(200103)24:1<43:EOUTOS>2.0.ZU;2-A
Abstract
Surface tension of material surfaces and interfaces is an important paramet er that affects wetting and adhesion. Surface tension can be divided into t hree components: Lifshitz-van der Waals component, acid component, and base component. In this study, the three-liquid-probe method was used to invest igate the surface tension and its three components of various surfaces of e lectronic packaging materials: benzocyclobutene (BCB) passivation, FR-4 boa rd, polyimide board, and alumina board. When UV/ozone was employed to treat the surfaces, the surface tension increased, and the base component increa sed the most. The change in surface tension due to UV/O-3 treatment decayed with time after the treatment. The difference in surface tension between u ntreated and treated surface became smaller with the increase of time after UV/O-3 treatment. Different substrates showed different rate of decay in s urface tension change. Among the surfaces studied, BCB passivation showed t he fastest decay after treatment, while alumina showed the slowest decay. T he contact angles of several liquid underfill materials on BCB passivation and their surface tension before and after curing were also measured. It wa s found that the wetting was not the controlling factor in adhesion of the system investigated.