Development of reliability and moldability on fine pitch ball grid array by optimizing materials

Authors
Aihara, T Ito, S Sasajima, H Oota, K
Citation
T. Aihara et al., Development of reliability and moldability on fine pitch ball grid array by optimizing materials, J ELEC PACK, 123(1), 2001, pp. 88-94
Citations number
2
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF ELECTRONIC PACKAGING
ISSN journal
10437398 → ACNP
Volume
123
Issue
1
Year of publication
2001
Pages
88 - 94
Database
ISI
SICI code
1043-7398(200103)123:1<88:DORAMO>2.0.ZU;2-M
Abstract
The market for EGA packages is expanding all over the world owing to the ea se of its mounting onto the PC boards. On the other hand, EGA packages poss ess certain short-comings compared to QFPs. Anti-solder crack performance o n Fine Pitch EGA (=FPBGA) and warpage on Mold Army Package-BGA(=MAP-BGA) or e significant disadvantages. To improve the performance of EGA packages, we studied various combinations of materials used for EGA package including m olding compounds, die attach pastes, and substrates.