A robust Co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS

Authors
Shih, CL Lai, BK Kahn, H Phillips, SM Heuer, AH
Citation
Cl. Shih et al., A robust Co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS, J MICROEL S, 10(1), 2001, pp. 69-79
Citations number
24
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
ISSN journal
10577157 → ACNP
Volume
10
Issue
1
Year of publication
2001
Pages
69 - 79
Database
ISI
SICI code
1057-7157(200103)10:1<69:ARCFPF>2.0.ZU;2-2
Abstract
Co-sputtering has been used to fabricate equiatomic thin films of TiNi, a s hape memory alloy which form the basis of microactuators with many applicat ions in MEMS. Methods for overcoming the difficulties involved in obtaining equiatomic TiNi thin films with high transformation temperatures, and a ro bust procedure suitable for batch fabrication in a production environment, are described.