Micromachining technology was utilized to fabricate a transparent microchan
nel heat-sink system by bonding glass to a silicon wafer. The micro heat si
nk consisted of a microchannel array, a heater, and a temperature sensor ar
ray. This integrated microsystem allowed simultaneous qualitative visualiza
tions of the flow pattern within the microchannels and quantitative measure
ments of temperature distributions, flow rates, and input power levels. Boi
ling curves of temperature as a function of the input power were establishe
d. No boiling plateau was observed in the boding curves, consistent with ou
r previously reported data but different from results reported for macrocha
nnel heat sinks. Three stable boiling modes, depending on the input power l
evel, have been distinguished from the flow patterns, Local nucleation boil
ing was observed in microchannels with a hydraulic diameter as small as 26
mum at the lower input power range. At the higher input power range, a stab
le annular flow was the dominant boiling mode. Bubbly flow commonly observe
d in macrochannels, could not be developed in the present microchannels. Co
nsequently, no bailing plateau was detected in the boiling curves.