Low-pressure chemical vapor deposition of semi-insulating polycrystalline silicon thin films II. Theoretical local analysis of the process

Citation
P. Barathieu et al., Low-pressure chemical vapor deposition of semi-insulating polycrystalline silicon thin films II. Theoretical local analysis of the process, J ELCHEM SO, 148(3), 2001, pp. C156-C161
Citations number
10
Categorie Soggetti
Physical Chemistry/Chemical Physics","Material Science & Engineering
Journal title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN journal
00134651 → ACNP
Volume
148
Issue
3
Year of publication
2001
Pages
C156 - C161
Database
ISI
SICI code
0013-4651(200103)148:3<C156:LCVDOS>2.0.ZU;2-3
Abstract
To improve mastery of the low pressure chemical vapor deposition semi-insul ating polycrystalline silicon (SIPOS) SiOx process, a local kinetic model d escribing homogeneous and heterogeneous phenomena is used to analyze the in fluence of some key operating parameters and of the main geometrical reacto r features on the process behavior. in particular, the gas hydrodynamics ne ar an interwafer space is detailed, and the role of each chemical species i nvolved in the deposit formation is investigated, with special attention pa id to the two radicalar molecules silylene and silanone. This analysis has allowed us to explain the origins of the radial heterogeneities on wafers f or each of the parameters investigated, thus opening possible ways of proce ss optimization. This study demonstrates how efficient such a modeling tool can be for improving the existing process performances, or even for design ing reactors. Such a mathematical approach is certainly a possible answer t o the increasingly drastic industrial requirements of the microelectronic h eld. (C) 2001 The Electrochemical Society. All rights reserved.