Characterization of (Ti,Al)N films deposited by off-plane double bend filtered cathodic vacuum arc

(Ti,Al)N films were deposited by a new off-plane double bend filtered catho dic vacuum are technique under a nitrogen atmosphere at room temperature. S canning electron microscopy and atomic force microscopy were used to observ e the surface morphology of the deposited films. X-ray photoelectron spectr oscopy was used to determine the composition and bonding structure of the d eposited films. A scratch test was used to access the film adhesion. The de posited films are atomically smooth and particle free. The Al/Ti atomic rat io in the deposited films is around 1. The films deposited at the pressure of 1 x 10(-4) Torr are composed of metallic Ti and Al phase and a small amo unt of (Ti,Al)N phase. For the films deposited at the pressure of 1.5 x 10( -3) Torr, (Ti, AI)N phases are dominant. The scratch test indicates that th e critical load increases with increasing deposition pressure up to 1.5 x 1 0(-3) Torr, then decrease drastically with the further increase of depositi on pressure. As substrate bias is increased, critical load increases and re achs the maximum at the bias of 200 V, then decreases at higher bias. The h ardness of the deposited films is found to be the main factor that affects the critical load of the thin films. (C) 2001 American Vacuum Society.