Plasma stabilization conducting shells end their impact on TBR and activation in CLIFF design

Plasma stabilization and plasma elongation are best achieved by keeping a s tabilizing shell as close as possible to the plasma. In CLiFF design, a 2-c m-thick flowing liquid layer is placed in front of a solid FW and is though t to be used as an active conduction shell if its conductance is relatively high such as with liquid lithium. On the other hand, higher conductance is achieved by solid shells (e.g. Cu, Al, FS, W, V alloy). In the present stu dy, the adverse effect of this stabilizing shell (whether it is liquid or s olid material) on tritium breeding ratio (TBR) is investigated. Among the d esign features that quantify this effect are: the type of breeder and struc ture, the degree of Li-6 enrichment, the material and thickness of the shel l, and whether or not there is a front beryllium multiplying zone in the bl anket. Additionally, the presence of a solid conducting shell near the FW w ill impose a safety concern in the case of LOCA. The present study addresse s this concern and comparison of the level of decay heat and waste disposal rating is made among the candidate materials for the stabilizing shell.