Peel strength and peel angle measured by the T-peel test on Cr/BPDA-PDA interfaces

The peel strength and peel angle of Cr/BPDA-PDA interfaces were measured us ing the T-peel rest for Cu/Cr/BPDA-PDA structures, When the Cu/Cr metal fil m war thin, plastic bending of the metal film occurred during the T-peel te st, With a thicker metal film, however. plastic bending of BPDA-PDA polyimi de was observed. The critical thickness of the metal film for the transitio n from metal film bending to polyimide bending became thinner M with decrea sing yield strength of the metal film, Regardless of the metal film bending or polyimide bending during the T-peel rest, the peel strength increased w ith higher peel angle and the failure mode or the Cr/BPDA-PDA interfaces wa s cohesive failure within BPDA-PDA.