A sensitive method has been developed for the measurement of mechanical str
esses in compliant planar samples originating from changes of their solvent
content or temperature. The samples are mechanically conjoined with a sili
con wafer. Thus, an alteration of the sample stress causes a spatial displa
cement of the wafer which is detected capacitively. The method is applied t
o the measurement of stresses in both acetone-dried and air-dried chrome-ta
nned leather which has been exposed to a stepwise modulation of ambient hum
idity. The stress development in the sample can be well characterized by a
first-order exponential decay. The mean moisture content exhibits a similar
time dependence. However, the relation between stress development and mois
ture content differs for swelling and shrinkage. This behavior is explained
on the basis of a novel two-capillary model. Moreover, the response of the
sample to the alteration of ambient humidity is found to be related to the
structure of its collagen fiber network. The tight structure of air-dried
leather with a poor isolation of fibrils yields much higher stresses than a
cetone-dried leather. (C) 2001 Kluwer Academic Publishers.