Cold-curing epoxy resins: Aging and environmental effects. I - Thermal properties

Citation
M. Frigione et al., Cold-curing epoxy resins: Aging and environmental effects. I - Thermal properties, J POLYM ENG, 21(1), 2001, pp. 23-51
Citations number
45
Categorie Soggetti
Material Science & Engineering
Journal title
JOURNAL OF POLYMER ENGINEERING
ISSN journal
03346447 → ACNP
Volume
21
Issue
1
Year of publication
2001
Pages
23 - 51
Database
ISI
SICI code
0334-6447(200101/02)21:1<23:CERAAE>2.0.ZU;2-V
Abstract
The effects of physical and chemical aging have been investigated on two co ld-curing epoxy adhesives. One of the two has been physically aged at different temperatures below its glass transition (i.e. 10, 23, 30 and 40 degreesC) and then subjected to e nthalpy relaxation measurements in a differential scanning calorimeter (DSC ). According to recent literature, DSC studies have suggested that enthalpy relaxation gradually increases with aging time to a limiting value, depend ing on the temperature, until structural equilibrium is reached. Specimens of both adhesives, previously cured at room temperature for 10 da ys, have been aged in a dry-dark atmosphere or in a freezer (-20 degreesC) for a prolonged time, measuring Tg and enthalpy relaxation at different tim e spans. When the structural equilibrium is reached, the samples aged in th e dark-dry atmosphere exhibit Tg and relaxation peak values similar to thos e found in the earlier analysis for samples isothermally cured at 23 degree sC. Samples aged at -20 degreesC, the curing time suggested by suppliers, w hich was not sufficient to cure the adhesives completely, have glass transi tion temperatures that are always lower. The cured adhesives have also been exposed to natural weather for up to 36 months. Some samples, taken at different periods of time, have been analyze d in DSC. Other samples have been subjected to a de-aging procedure (24 hou rs at 50 degreesC) before the thermal analysis. The natural exposition, reg arded as chemical aging, determines a cycling change of Tg of both adhesive s around average values slightly lower than the initial ones. This behavior cannot be erased by the de-aging procedure, which is able to delete only t he effects due to physical aging. Enthalpy relaxation peaks, characteristic s of physical aging, are observed only for exposed samples not subjected to de-aging procedure. These samples, finally, are subjected during the natur al exposition to aging and de-aging processes taking place in nonisothermal conditions and, therefore, not predictable. The presented study must be regarded as a qualitative analysis of the aging phenomena taking place in cold curing epoxy resins.