A percolative simulation of electromigration phenomena

Citation
C. Pennetta et al., A percolative simulation of electromigration phenomena, MICROEL ENG, 55(1-4), 2001, pp. 349-353
Citations number
5
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONIC ENGINEERING
ISSN journal
01679317 → ACNP
Volume
55
Issue
1-4
Year of publication
2001
Pages
349 - 353
Database
ISI
SICI code
0167-9317(200103)55:1-4<349:APSOEP>2.0.ZU;2-V
Abstract
Resistance degradation of metallic strips due to electromigation is studied within a percolative approach based on a random resistor network. Both def ect generation and recovery driven by a current stress are considered. The main features of experiments performed on Al-0.5%Cu lines are well reproduc ed, thus providing a unified description of degradation processes in terms of physical parameters. (C) 2001 Elsevier Science B.V. All rights reserved.