Advanced IC packaging: Markets and trends

Authors
Winkler, S
Citation
S. Winkler, Advanced IC packaging: Markets and trends, SOL ST TECH, 44(4), 2001, pp. 44
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLID STATE TECHNOLOGY
ISSN journal
0038111X → ACNP
Volume
44
Issue
4
Year of publication
2001
Database
ISI
SICI code
0038-111X(200104)44:4<44:AIPMAT>2.0.ZU;2-5