Navigating yield through the maze of copper CMP defects

Citation
S. Guha et al., Navigating yield through the maze of copper CMP defects, SOL ST TECH, 44(4), 2001, pp. 63
Citations number
7
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLID STATE TECHNOLOGY
ISSN journal
0038111X → ACNP
Volume
44
Issue
4
Year of publication
2001
Database
ISI
SICI code
0038-111X(200104)44:4<63:NYTTMO>2.0.ZU;2-S
Abstract
Many types of defects arise from the copper CMP step, and careful inspectio n and an understanding of the failure mechanisms allow processes to be modi fied to reduce the defect levels. Some of the defects that appear at copper CMP actually come from previous process steps, so the right inspection and analysis approach can improve entire process modules.