Leakage current of offset gate p- and n-channel excimer laser annealed polycrystalline silicon thin-film transistors

Citation
Ca. Dimitriadis et al., Leakage current of offset gate p- and n-channel excimer laser annealed polycrystalline silicon thin-film transistors, SOL ST ELEC, 45(2), 2001, pp. 365-368
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Eletrical & Eletronics Engineeing
Journal title
SOLID-STATE ELECTRONICS
ISSN journal
00381101 → ACNP
Volume
45
Issue
2
Year of publication
2001
Pages
365 - 368
Database
ISI
SICI code
0038-1101(200102)45:2<365:LCOOGP>2.0.ZU;2-T
Abstract
The leakage current I-L of offset gate n- and p-channel excimer laser annea led polycrystalline silicon thin-film transistors (polysilicon TFTs) has be en investigated experimentally. It has been found that the leakage current is almost independent of the polysilicon layer quality, in n-type polysilic on TFTs, I-L arises from band-to-band tunneling due to extension of the dra in junction to the gate end by diffusion of phosphorus ions fr om the drain contact within the offset region. In p-channel TFTs, I-L first increases r apidly and then saturates at high drain voltages. This leakage current beha vior is explained qualitatively by a model based on the change of the effec tive offset length, caused by the applied drain voltage on the positive ion s of boron, diffused from the drain contact within the offset region. (C) 2 001 Elsevier Science Ltd, All rights reserved.