Improved inversion channel mobility for 4H-SiC MOSFETs following high temperature anneals in nitric oxide

Citation
Gy. Chung et al., Improved inversion channel mobility for 4H-SiC MOSFETs following high temperature anneals in nitric oxide, IEEE ELEC D, 22(4), 2001, pp. 176-178
Citations number
15
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE ELECTRON DEVICE LETTERS
ISSN journal
07413106 → ACNP
Volume
22
Issue
4
Year of publication
2001
Pages
176 - 178
Database
ISI
SICI code
0741-3106(200104)22:4<176:IICMF4>2.0.ZU;2-9
Abstract
Results presented in this letter demonstrate that the effective channel mob ility of lateral, inversion-mode 4H-SiC MOSFETs is increased significantly after passivation of SiC/SiO2 interface states near the conduction band edg e by high temperature anneals in nitric oxide. Hi-lo capacitance-voltage (C -V) and ac conductance measurements indicate that, at 0.1 eV below the cond uction band edge, the interface trap density decreases front approximately 2 x 10(13) to 2 x 10(12) eV(-1)cm(-2) following anneals in nitric oxide at 1175 degreesC for 2 h. The effective channel mobility for MOSFETs fabricate d with either wet or dry oxides increases by an order of magnitude to appro ximately 30-35 cm(2) /V-s following the passivation anneals.