Resonant tunneling diodes (RTDs) with strained i-Si0.4Ge0.6 potential barri
ers and a strained i-Si quantum well, all on a relaxed Si0.8Ge0.2 virtual s
ubstrate were successfully grown by ultra high vacuum compatible chemical v
apor deposition and fabricated using standard Si processing methods. A larg
e peak to valley current ratio of 2.9 and a peak current density of 4.3 kA/
cm(2) at room temperature were recorded from pulsed and continuous dc curre
nt-voltage measurements, the highest reported values to date for Si/Si1-xGe
x RTDs. These de figures of merit and material system render such structure
s suitable and highly compatible with present high speed and low power Si/S
i1-xGex heterojunction field effect transistor based integrated circuits.