Review on materials, microsensors, systems, and devices for high-temperature and harsh-environment applications

The considerable investment in silicon technology has rarely addressed devi ce use in harsh environments such as high temperatures, aggressive media, a nd radiation exposure. A clear future requirement is to save weight, volume , and reduce costs in "unfriendly" environments like high temperatures. Thi s can be achieved either by cooling systems or by electronic microsystem co mponents suited to withstand high temperatures. The current status of cooli ng systems, harsh-environment sensors, and microsystems in view of markets, realized devices, material, properties, process maturity, and packaging te chnologies will be reviewed. Possible semiconductor candidates for high-tem perature applications are being discussed. The main obstacles for the futur e of high-temperature and harsh-environment microsystems will be highlighte d.