An integrated micro cooling system for electronic circuits

A fully FR4-compatible integrated cooling system has been developed. Coolin g channels have been etched into a thick copper lay er to form microchannel s. The structure is reinforced by two prepreg layers toward the component a nd solder side. Several cooling channels can be independently run. The heat dissipation capability of the system is 20 W per channel (and heat source) . Typical coolants are water or methoxynonafluorobutane. For an outlet to i nlet temperature difference of 25 degreesC and a power dissipation of 30 W, a (water) flow rate of 20 mL/min is required. Pressure losses are below 30 0 mbar (for water).