Micro thermal management of high-power diode laser bars

Lifetime and reliability of high-power diode laser bars are sensitively rel ated to operating temperature, mounting stress, and solder electromigration . These three factors have been taken into account for the development of a new packaging technology for 1-cm laser bars of gallium arsenide. We exami nae the use of chemical-vapor-deposited (CVD) diamond as heatspreaders in o rder to reduce thermal resistance of a microchannel cooler for Liquid cooli ng. We show that it is possible to perform hard soldering on a CVD-diamond with a new technique. Additionally, we present a controlled water cooling s ystem fit to the now characteristics of the cooler. It permits one to adjus t the emission wavelength of the diode lasers by changing the water flux.