Multiwafer silicon designs must provide an avenue for electrical signals to
flow from wafer to wafer, For this purpose, a two-layer electrical bond is
proposed to provide electrical connection between two coplanar waveguides
printed on the adjacent faces of two vertically stacked silicon wafers. In
addition to serving as a versatile low-temperature thermocompression wafer
bond, loss of approximately 0.1 dB is measured for this novel compact packa
ged wafer-to-wafer transition from 75 to 110 GHz.