Microcomposite electroforming for LIGA technology

Authors
Chou, MC Yang, H Yeh, SH
Citation
Mc. Chou et al., Microcomposite electroforming for LIGA technology, MICROSYST T, 7(1), 2001, pp. 36-39
Citations number
7
Categorie Soggetti
Instrumentation & Measurement
Journal title
MICROSYSTEM TECHNOLOGIES
ISSN journal
09467076 → ACNP
Volume
7
Issue
1
Year of publication
2001
Pages
36 - 39
Database
ISI
SICI code
0946-7076(200103)7:1<36:MEFLT>2.0.ZU;2-U
Abstract
Effective methods to improve hardness and thickness uniformity in electrofo rming for the LIGA process to produce metallic microstructures are describe d. The result shows the internal stress of Ni-Co alloy deposit can be well tuned between 2 to -2 kg/mm(2) by adding a stress release agent into the el ectroplating bath. A secondary cathode is applied to improve the thickness uniformity in electroforming without loss plating rate at the center of the features.