dWe present a new paradigm of Si technologies to establish a gigahertz-oper
ation gigascale integrated system large-scale integration (LSI), including
digital and analog circuits. According to the theoretical analysis of high-
speed signal propagation properties in the practical LSI structure, a gas-i
solated-interconnect high-k gate di-electric metal-gate metal-substrate sil
icon-on-insulator (SOI) LSI structure is proposed as a possible solution fo
r a future gigahertz GSI system LSI, where the clock rate is improved up to
beyond 10 Ghz and the minimum feature size is reduced down to 0.035 mum wi
th keeping a continuous progress of the LSI's speed performance. Perfect sc
ientific manufacturing free from fluctuations consisting of total low-tempe
rature high-quality and high-speed processes based on very high-density pla
sma having very low electron temperatures is essential to realize them.