We present a timing- and crosstalk-driven router for the chip assembly task
that is applied between global and detailed routing. Our new approach aims
to process the crosstalk and timing constraints by ordering nets and tunin
g wire spacing in a quantitative way. The new approach fits between global
routing and detailed muting along the physical design flow It is the first
to address the timing- and crosstalk-driven area routing problem using cros
spoint assignment prior to the detailed routing stage, in contrast to the m
ost previous approaches applied in the post-detailed routing stage. Our new
approach enjoys a larger optimization solution space than the previous app
roaches whose solution space is highly Limited by routed geometric constrai
nts, Based on the global routing information, our graph-based optimizer pre
routes wires on the global routing grids incrementally, The graph-based opt
imizer has two stages, net order assignment and space relaxation, A quick c
apacitance extraction and Elmore delay calculator considering signal switch
ing activities are implemented to find the timing of critical nets and to p
rovide the timing slack database of critical nets. As the graph-based algor
ithm proceeds, the path delay of critical nets and the timing slack databas
e are updated, During the optimization process, it only optimizes the timin
g critical paths with negative slack values, The experimental results show
a 5%-16% delay reduction for MCNC macrocell benchmark circuits far a 0.25-m
um process for wire geometric ratio (height/width) = 1.0, against a 25% del
ay reduction if there is infinite space around each metal,Fire on the same
layer. it shows a remarkable 8.4%-25% delay reduction for MCNC benchmarks f
or wire geometric ratio = 2.0, against a 33% delay reduction if there is in
finite space around each metal wire. its experimental results indicate, our
new approach overall achieves an average 46% reduction on intralayer coupl
ing capacitance. Therefore, the delay reduction by our optimizer is more si
gnificant when the minimum feature size continuously shrinks and the wire g
eometric ratio increases.