Strain relaxation of GaN nucleation layers during rapid thermal annealing

Authors
Citation
Ms. Yi et Dy. Noh, Strain relaxation of GaN nucleation layers during rapid thermal annealing, APPL PHYS L, 78(17), 2001, pp. 2443-2445
Citations number
15
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
78
Issue
17
Year of publication
2001
Pages
2443 - 2445
Database
ISI
SICI code
0003-6951(20010423)78:17<2443:SROGNL>2.0.ZU;2-A
Abstract
The strain relaxation of GaN nucleation layers grown on sapphire (0001) dur ing rapid thermal annealing was studied in a synchrotron x-ray scattering e xperiment. The as-grown GaN nucleation layer is compressively strained. Upo n annealing to 750 degreesC, the lattice strain first changes to tensile. T his tensile strain is released progressively as the annealing temperature i ncreases. The nucleation layer sublimates significantly at 1050 degreesC wh ere it becomes mostly strain-free hexagonal GaN. (C) 2001 American Institut e of Physics.