Fabrication and transport AC losses of (Bi,Pb) 2223 multifilamentary tapeswith resistive barriers

Citation
Px. Zhang et al., Fabrication and transport AC losses of (Bi,Pb) 2223 multifilamentary tapeswith resistive barriers, IEEE APPL S, 11(1), 2001, pp. 2784-2787
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
ISSN journal
10518223 → ACNP
Volume
11
Issue
1
Year of publication
2001
Part
3
Pages
2784 - 2787
Database
ISI
SICI code
1051-8223(200103)11:1<2784:FATALO>2.0.ZU;2-N
Abstract
The Ag-sheathed (Bi,Pb)-2223 multifilamentary tapes with different filament distribution and resistive barriers have been fabricated by powder-in-tube (PIT) method. A rectangular deformation process by using a four-roller mac hine was applied to fabricate the multifilamentary wires, Bi-2201 and Ag-Cu alloy sheets were introduced into the tape as resistive layers to decrease the coupling between filaments, The transport ac losses were measured on t hese tapes at 77K with power frequency between 50Hz and 1000Hz The results indicated that the behaviors of transport sc losses are influenced by both filament distribution and resistive barrier, introduction of resistive barr iers to divide the tape into several thin strips is effective to reduce the transport sc losses. For the prepared 39 filament tapes, when the resistiv e layers are configured parallel to the tape surface, the transport sc loss es at 50Hz measured at 77K are greatly reduced compared to those of 37 fila ment tape without barriers fabricated by a conventional PIT method.