Px. Zhang et al., Fabrication and transport AC losses of (Bi,Pb) 2223 multifilamentary tapeswith resistive barriers, IEEE APPL S, 11(1), 2001, pp. 2784-2787
The Ag-sheathed (Bi,Pb)-2223 multifilamentary tapes with different filament
distribution and resistive barriers have been fabricated by powder-in-tube
(PIT) method. A rectangular deformation process by using a four-roller mac
hine was applied to fabricate the multifilamentary wires, Bi-2201 and Ag-Cu
alloy sheets were introduced into the tape as resistive layers to decrease
the coupling between filaments, The transport ac losses were measured on t
hese tapes at 77K with power frequency between 50Hz and 1000Hz The results
indicated that the behaviors of transport sc losses are influenced by both
filament distribution and resistive barrier, introduction of resistive barr
iers to divide the tape into several thin strips is effective to reduce the
transport sc losses. For the prepared 39 filament tapes, when the resistiv
e layers are configured parallel to the tape surface, the transport sc loss
es at 50Hz measured at 77K are greatly reduced compared to those of 37 fila
ment tape without barriers fabricated by a conventional PIT method.