Properties of Ag-Cu alloy substrate for Y-Ba-Cu-O superconducting tape

Textured structure, surface morphology and tensile strength of Ag-Cu alloy tapes and Ag-Cu / Ni alloy clad tapes are studied by using XRD, pole figure , SEM and AFM. An addition of Cu was effective for improving surface smooth ness; (210)< 120 > textured structure, on which YBCO film aligns in-plane, was obtained in Ag-Cu tape. Clad tapes which have 2-4 times higher proof st ress 60.2 than pure Ag at 700 degreesC were obtained. These clad tapes are expected to be useful for obtaining low-cost and high-Jc YBCO superconducti ng tape.