U. Poppe et al., Properties of YBa2Cu3O7 thin films deposited on substrates and bicrystals with vicinal offcut and realization of high IcRn junctions, IEEE APPL S, 11(1), 2001, pp. 3768-3771
The surface morphology, microstructure and transport properties of epitaxia
l YBa2Cu3O7 and PrBa2Cu3O7 thin films and heterostructures deposited on sli
ghtly vicinal substrates of SrTiO3 by high pressure oxygen sputtering were
studied. The vicinal angles of the substrates and bicrystals were less then
13 degrees. Depending on the tilt angle of the substrate a transition from
spiral or island to step-flow growth leading to an improvement of the surf
ace roughness was observed. Atomic force and transmission electron microsco
py were used for these investigations. Furthermore, electrical and structur
al properties of YBa2Cu3O7 thin films on vicinal offcut SrTiO3 bicrystals w
ith different grain boundary types were studied. This included junctions wi
th a 2x 12 degrees tilt or twist of the YBa2Cu3O7 c-axis across the grain b
oundary. In comparison to conventional [001]-tilt grain boundaries bicrysta
l Josephson junctions [100]-tilt grain boundaries showed high I-c R-n -prod
ucts of up to 1.2 meV at 77 K and up to 8 meV at 4.2 K. IV-curve instabilit
ies, probably of magnetic origin due to flux flow in the electrodes, often
could he observed for junctions biased with high current densities.