Fabrication and characterization of Y-Ba-Cu-O and Nd-Ba-Cu-O ramp-edge junctions with an interface-modified barrier

Citation
T. Makita et al., Fabrication and characterization of Y-Ba-Cu-O and Nd-Ba-Cu-O ramp-edge junctions with an interface-modified barrier, IEEE APPL S, 11(1), 2001, pp. 155-158
Citations number
12
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
ISSN journal
10518223 → ACNP
Volume
11
Issue
1
Year of publication
2001
Part
1
Pages
155 - 158
Database
ISI
SICI code
1051-8223(200103)11:1<155:FACOYA>2.0.ZU;2-A
Abstract
The fabrication process for YBa2Cu3O7-delta (YBCO) ramp-edge junctions with an interface-modified barrier has been studied. The conditions of electron cyclotron resonance (ECR) ion etching and following annealing treatment we re optimized by evaluating the mean roughness of the ramp surface using ato mic force microscope (AFM) observation. We could obtain resistively-shunted junction (RSJ) type current-voltage characteristics for the junctions with the counterelectrode YBCO layer deposited at temperatures lower than 720 d egreesC, while the deposition temperature higher than 755 degreesC resulted in a high-J(c) superconducting contact. The junctions exhibited an IcRn pr oduct of 1.0 - 1.9 mV and magnetic field modulation of I-c more than 90 % a t 4.2 K, By applying the optimum etching condition to a NdBa2Cu3O7-delta (N BCO) base electrode and employing a slightly higher annealing and depositio n temperature, YBCO/NBCO ramp-edge Josephson junctions with a similar IcRn product were successfully obtained.