3D-MLSI: Software package for inductance calculation in multilayer superconducting integrated circuits

Citation
Mm. Khapaev et al., 3D-MLSI: Software package for inductance calculation in multilayer superconducting integrated circuits, IEEE APPL S, 11(1), 2001, pp. 1090-1093
Citations number
6
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY
ISSN journal
10518223 → ACNP
Volume
11
Issue
1
Year of publication
2001
Part
1
Pages
1090 - 1093
Database
ISI
SICI code
1051-8223(200103)11:1<1090:3SPFIC>2.0.ZU;2-K
Abstract
A new software package 3D-MLSI was developed for inductance calculation in multilayer superconducting integrated circuits. The key advantages of 3D-ML SI are: new mathematical model that takes into account 3D distribution of m agnetic field, user interface compatible with the Cadence and ACAD design t ools, The program is most applicable in case of technology when both kineti c and magnetic inductances Are important. Method of equivalent circuits ind uctances exraction is suggested.