New analysis on the fiber push-out problem with interface roughness and thermal residual stresses

Authors
Citation
Ys. Chai et Yw. Mai, New analysis on the fiber push-out problem with interface roughness and thermal residual stresses, J MATER SCI, 36(8), 2001, pp. 2095-2104
Citations number
19
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE
ISSN journal
00222461 → ACNP
Volume
36
Issue
8
Year of publication
2001
Pages
2095 - 2104
Database
ISI
SICI code
0022-2461(200104)36:8<2095:NAOTFP>2.0.ZU;2-H
Abstract
An improved analysis considering the effects of interface roughness and the rmal residual stresses in both radial and axial directions is developed for the single fiber push-out test. The roughness of the interface, which has a significant effect on the fiber sliding behavior, is expressed by a Fouri er series expansion that has good convergence and can handle general shapes of roughness. The interfacial shear stress that plays an important role in interfacial debonding is very much affected by the axial thermal residual stress in the bonded region, which can induce a two-way debonding mechanism . It has been found that both residual stress and interface roughness have pronounced effects on the stress transfer across the interface and interfac ial debonding behaviour. (C) 2001 Kluwer Academic Publishers.