High density plasma etching of low k dielectric polymers in oxygen-based chemistries

Citation
D. Fuard et al., High density plasma etching of low k dielectric polymers in oxygen-based chemistries, J VAC SCI B, 19(2), 2001, pp. 447-455
Citations number
24
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
19
Issue
2
Year of publication
2001
Pages
447 - 455
Database
ISI
SICI code
1071-1023(200103/04)19:2<447:HDPEOL>2.0.ZU;2-L
Abstract
We have studied the etching of low dielectric constant polymers in halogen- and sulfur-free chemistries under various plasma operating conditions. The polymer graphitization phenomenon, which corresponds to the transformation of the aromatic hydrocarbon network into an amorphous carbon backbone, has been fully investigated under several plasma conditions by in situ mass sp ectrometry and quasi-in situ x-ray photoelectron spectroscopy (XPS). Profil e control in high aspect ratio contact holes is obtained thanks to the form ation of a passivation layer on the polymer sidewalls preventing the sponta neous chemical attacks by the oxygen reactive species of the plasma. XPS st udies show that the passivation layer only forms under conditions where the plasma induces a polymer graphitization. Strong correlations are observed between plasma conditions leading to the polymer graphitization, the presen ce of heavy carbon byproducts detected in the plasma gas phase, and the pas sivation layer formation. (C) 2001 American Vacuum Society.